Deutschland

Nederland

España

United Kingdom

United States

Belgium

Україна

Sverige

Österreich

Switzerland

Italia

France

Czech Republic

Беларусь

Bulgaria

Slovenia

Hrvatska

Bosnia and Herzegovina

Россия

Estonia

Latvija

Lithuania

Greece

Κύπρος

Malta

Ireland

Portugal

Iceland

Danmark

Polska

România

Magyarország

Suomi

Norway

Slovakia

Australia

中囯

Andorra

United Arab Emirates

Afghanistan

Antigua and Barbuda

Anguilla

Albania

Armenia

Netherlands Antilles

Angola

Argentina

American Samoa

Aruba

Barbados

Bangladesh

Burkina Faso

Bahrain

Burundi

Bénin

Bermuda

Brunei Darussalam

Bolivia

Brasil

Bahamas

Bhutan

Bouvet Island

Botswana

Belize

Canada

Cocos (Keeling) Islands

République centrafricaine

République démocratique du Congo

Congo

Côte d’Ivoire

Cook Islands

Chile

Cameroun

Colombia

Costa Rica

Cuba

Cabo Verde

Christmas Island

Dominica

República Dominicana

Algérie

Ecuador

Égypte

Western Sahara

Eritrea

Ethiopia

Fiji

Falkland Islands (Malvinas)

Micronesia, Federated States of

Faroe Islands

Gabon

Grenada

საქართველო

Guyane française

Ghana

Gibraltar

Greenland

Gambia

Guinée

Guadeloupe

English

Deutsch

Français

Español

Catalán

Dansk

Deutsch (AT)

Deutsch (BE)

Deutsch (CH)

English (AU)

English (CA)

English (ID)

English (IE)

English (IN)

English (MY)

English (NZ)

English (PH)

English (SA)

English (SG)

English (US)

English (ZA)

Español (AR)

Español (CL)

Español (CO)

Español (MX)

Español (PE)

Estonian

Filipino

Français (BE)

Français (CA)

Français (CH)

Hrvatski

Indonesian

Italiano

Italiano (CH)

Latviski

Lietuviškai

Magyar

Malay

Malayalam

Nederlands

Nederlands (BE)

Norsk

Polski

Português

Português (BR)

Română

Slovenski

Slovenský

Srpski/Српски

Svenska

Thai

Tiếng Việt 

Türkçe

UAE (EN)

Česky

Ελληνικά

Български

Македонски

Українська

עברית

العربية

العربية (مصر)

فارسی

मराठी

हिंदी

বাংলা

தமிழ்

తెలుగు

ಕನ್ನಡ

ქართული

中文 (简体)

中文 (繁體)

日本語

한국인

Viscous fluid which increases the thermal conductivity of a thermal interface by filling microscopic air-gaps present due to the imperfectly flat and smooth surfaces of the components. In electronics, it is often used to aid a component's thermal dissipation via a heat sink.

R5250 additional CPU Heatsink 

Acer R5250 additional CPU Heatsink 散熱膏